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 HANBit
HMF1M32M8P
FLASH-ROM MODULE 4MByte (1M x 32-Bit), 72pin-SIMM, 5V Part No. HMF1M32M8P
GENERAL DESCRIPTION
The HMF1M32M8P is a high-speed flash read only memory (FROM) module containing 1,048,576 words organized in a x32bit configuration. The module consists of eight 512K x 8 FROM mounted on a 72 -pin, single-sided, FR4-printed circuit board. Commands are written to the command register using standard microprocessor write timings. Register contents serve as input to an internal state-machine, which controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the device is similar to reading from 12.0V flash or EPROM devices. Eight chip enable inputs, (/CE_UU1, /CE_UM1, /CE_LM1, /CE_LL1, /CE_UU2, /CE_UM2, /CE_LM2, /CE_LL2) are used to enable the module's 4 bytes independently. Output enable (/OE) and write enable (/WE) can set the memory input and output..When FROM module is disable condition the module is becoming power standby mode, system designer can get low power design. All module components may be powered from a single +5V DC power supply and all inputs and outputs are TTL-compatible.
FEATURES
w Access time: 55, 70, 90 and 120ns w High-density 4MByte design w High-reliability, low-power design w Single + 5V 0.5V power supply w Easy memory expansion w All inputs and outputs are TTL-compatible w FR4-PCB design w Low profile 72-pin SIMM w Minimum 1,000,000 write/erase cycle w Sector erases architecture w Sector group protection w Temporary sector group unprotection PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 -55 -70 -90 -120 22 23 M 24 A17 A14 A13 18 19 20 21 120ns access w Packages 72-pin SIMM SYMBOL Vss A3 A2 A1 A0 Vcc A11 /OE A10 Vcc /CE_LL2 /CE_LL1 DQ7 DQ0 DQ1 DQ2 DQ6 DQ5 DQ4 DQ3 /WE
PIN ASSIGNMENT
PIN 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 SYMBOL Vcc DQ8 DQ9 DQ10 /CE_LM2 Vcc /CE_LM1 DQ15 DQ14 DQ13 DQ12 DQ11 A18 A16 Vss A6 Vcc A5 A4 Vcc /CE_UM2 /CE_UM1 DQ23 DQ16 PIN 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 SYMBOL DQ17 DQ18 DQ22 DQ21 DQ20 DQ19 Vcc A15 A12 A7 Vcc A8 A9 DQ24 DQ25 DQ26 /CE_UU2 /CE_UU1 DQ31 DQ30 DQ29 DQ28 DQ27 Vss
OPTIONS
w Timing
55ns access 70ns access 90ns access
MARKING
URL : www.hbe.co.kr REV.02(August,2002)
1
72-PIN SIMM TOP VIEW
HANBit Electronics Co., Ltd.
HANBit
FUNCTIONAL BLOCK DIAGRAM
DQ 0-DQ31 A0-A18 DQ 32 A19
HMF1M32M8P
A0-18
A0-18 DQ0-7 /WE /OE /CE-LL2
A0-18 DQ0-7 /WE
U1
/CE
/CE-LL1
/OE
U5
/CE
A0-18 DQ8-15 /WE /OE
A0-18 DQ8-15
/WE
U2
/CE
/CE-LM1
/OE /CE
U6
/CE-LM2
A0-18 DQ 16-23 /WE /OE /CE-UM2
A0-18 DQ16-23 /WE
U3
/CE /CE-UM1
/OE
U7
/CE
A0-18 /WE /WE /OE /OE DQ24-31 /WE
A0-18 DQ 24-31 /WE /OE
U4
/CE
/OE
U8
/CE
/CE-UU2
/CE-UU1
TRUTH TABLE
MODE STANDBY NOT SELECTED READ WRITE or ERASE NOTE: X means don't care /OE X H L X /CE H L L L /WE X H H L DQ HIGH-Z HIGH-Z Q D POWER STANDBY ACTIVE ACTIVE ACTIVE
URL : www.hbe.co.kr REV.02(August,2002)
2
HANBit Electronics Co., Ltd.
HANBit
ABSOLUTE MAXIMUM RATINGS
PARAMETER Voltage with respect to ground all other pins Voltage with respect to ground Vcc Storage Temperature SYMBOL VIN,OUT VCC TSTG
HMF1M32M8P
RATING -2.0V to +7.0V -2.0V to +7.0V -65oC to +125oC
Operating Temperature TA -55oC to +125 oC w Stresses greater than those listed under " Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions ab ove those indicated in the operating section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
RECOMMENDED DC OPERATING CONDITIONS
PARAMETER Vcc for 5% device Supply Voltages Vcc for 10% device Supply Voltages Ground SYMBOL VCC Vcc VSS MIN 4.75V 4.5V 0 0 TYP. MAX 5.25V 5.5V 0
DC AND OPERATING CHARACTERISTICS (0oC TA 70 oC ; Vcc = 5V 0.5V )
PARAMETER Input Leakage Current Output Leakage Current Output High Voltage Output Low Voltage Vcc Active Current for Read(1) Vcc Active Current for Program /CE = VIL, /OE=VIH or Erase(2) Vcc Standby Current Low Vcc Lock-Out Voltage Notes: 1. The Icc current listed is typically less than 2mA/MHz, with /OE at V IH. 2. Icc active while embedded algorithm (program or erase) is in progress 3. Maximum Icc current specifications are tested with Vcc=Vcc max /CE= VIH ICC3 VLKO 3.2 1.0 4.2 mA V ICC2 40 mA TEST CONDITIONS Vcc=Vcc max, V IN= GND to Vcc Vcc=Vcc max, VOUT= GND to Vcc IOH = -2.5mA, Vcc = Vcc min IOL = 12mA, Vcc =Vcc min /CE = VIL, /OE=VIH, SYMBOL IL1 IL0 VOH VOL ICC1 2.4 0.45 12 MIN MAX 1.0 1.0 UNITS A A V V mA
URL : www.hbe.co.kr REV.02(August,2002)
3
HANBit Electronics Co., Ltd.
HANBit
ERASE AND PROGRAMMING PERFORMANCE
LIMITS PARAMETER MIN. Sector Erase Time TYP. 1 MAX. UNIT
HMF1M32M8P
COMMENTS Excludes 00H programming
8
sec prior to erasure Excludes system-level overhead Excludes system-level
Byte Programming Time
-
7
300
s
Chip Programming Time
-
3.6
10.8
sec overhead
CAPACITANCE
PARAMETER SYMBOL CIN COUT CIN2 PARAMETER TEST SETUP DESCRIPTION Input Capacitance Output Capacitance Control Pin Capacitance
o
TYP. 4 8 8
MAX 6 12 12
UNIT pF pF pF
VIN = 0 VOUT = 0 VIN = 0
Notes : Test conditions TA = 25 C, f=1.0 MHz.
AC CHARACTERISTICS u Read Only Operations Characteristics
PARAMETER SYMBOLS JEDEC tAVAV tAVQV STANDARD tRC tACC Address to Output Delay /OE = VIL tELQV tGLQV tEHQZ tGHQZ tAXQX tCE tOE tDF tDF tQH /CE or /OE, Whichever Occurs First Chip Enable to Output Delay Chip Enable to Output Delay Chip Enable to Output High-Z Output Enable to Output High-Z Output Hold Time From Addresses, Min 0 0 ns /OE = VIL Max Max Max Max 55 30 18 18 90 35 20 20 ns ns ns ns Read Cycle Time /CE = V IL Max 55 90 ns Min 55 90 ns DESCRIPTION TEST SETUP -55 -90 UNIT
Notes : Test Conditions : Output Load : 1TTL gate and Output Load Capacitance 100 pF, in case of 55ns-30pF Input rise and fall times : 5 ns , In case of 55ns-5ns Input pulse levels : 0 .45V to 2.4V, In case of 55ns- 0.0V-3.0V Timing measurement reference level
URL : www.hbe.co.kr REV.02(August,2002)
4
HANBit Electronics Co., Ltd.
HANBit
Input : 0.8V, Incase of 55ns-1.5V Output : 2.0V, In case of 55ns-1.5V 5.0V
HMF1M32M8P
2.7k Device Under Test CL IN3064 or Equivalent
6.2k
Diodes = IN3064 or Equivalent
Note : CL = 100pF including jig capacitance
u Erase/Program Operations
PARAMETER SYMBOLS DESCRIPTION JEDEC tAVAV tAVWL tWLAX tDVWH tWHDX STANDARD tWC tAS tAH tDS tDH tOES tGHWL tELWL tWHEH tWLWH tWHWL tWHWH1 tWHWH2 tGHWL tCS tCH tWP tWPH tWHWH1 tWHWH2 tVCS Notes : 1. This does not include the preprogramming time 2. This timing is only for Sector Protect operations Write Cycle Time Address Setup Time Address Hold Time Data Setup Time Data Hold Time Output Enable Setup Time Read Recover Time Before Write /CE Setup Time /CE Hold Time Write Pulse Width Write Pulse Width High Byte Programming Operation Sector Erase Operation (Note1) Vcc set up time Min Min Min Min Min Min Min Min Min Min Min Typ Typ Min 55 0 40 25 0 0 0 0 0 30 20 7 1 50 90 0 45 45 0 0 0 0 0 45 20 7 1 50 ns ns ns ns ns ns ns ns ns ns ns s sec s -55 -90 UNIT
URL : www.hbe.co.kr REV.02(August,2002)
5
HANBit Electronics Co., Ltd.
HANBit
u Erase/Program Operations Alternate /CE Controlled Writes
PARAMETER SYMBOLS DESCRIPTION JEDEC tAVAV tAVEL tELAX tDVEH tEHDX STANDARD tWC tAS tAH tDS tDH tOES tGHEL tWLEL tEHWH tELEH tEHEL tWHWH1 tWHWH2 tGHEL tWS tWH tCP tCPH tWHWH1 tWHWH2 Write Cycle Time Address Setup Time Address Hold Time Data Setup Time Data Hold Time Output Enable Setup Time Read Recover Time Before Write /WE Setup Time /WE Hold Time /CE Pulse Width /CE Pulse Width High Byte Programming Operation Sector Erase Operation (Note) Min Min Min Min Min Min Min Min Min Min Min Typ Typ 55 0 40 25 0 0 0 0 0 30 20 7 1 -55
HMF1M32M8P
-90 90 0 45 45 0 0 0 0 0 45 20 7 1
UNIT ns ns ns ns ns ns ns ns ns ns ns s sec
Notes : This does not include the preprogramming time.
URL : www.hbe.co.kr REV.02(August,2002)
6
HANBit Electronics Co., Ltd.
HANBit
u READ OPERATIONS TIMING
HMF1M32M8P
u RESET TIMING
URL : www.hbe.co.kr REV.02(August,2002)
7
HANBit Electronics Co., Ltd.
HANBit
u PROGRAM OPERATIONS TIMING
HMF1M32M8P
u CHIP/SECTOR ERASE OPERATION TIMINGS
URL : www.hbe.co.kr REV.02(August,2002)
8
HANBit Electronics Co., Ltd.
HANBit
u DATA# POLLING TIMES(DURING EMBEDDED ALGORITHMS)
HMF1M32M8P
u TOGGLE# BIT TIMINGS (DURING EMBEDDED ALGORITHMS)
URL : www.hbe.co.kr REV.02(August,2002)
9
HANBit Electronics Co., Ltd.
HANBit
u SECTOR PROTECT UNPROTECT TIMEING DIAGRAM
HMF1M32M8P
u ALTERNATE CE# CONTROLLED WRITE OPERATING TIMINGS
URL : www.hbe.co.kr REV.02(August,2002)
10
HANBit Electronics Co., Ltd.
HANBit
PACKAGE DIMENSIONS
HMF1M32M8P
2.54 mm 0.25 mm MAX
MIN
1.290.08 mm Gold: 1.040.10 mm 1.27 Solder: 0.9140.10 mm
(Solder & Gold Plating)
ORDERING INFORMATION
Part Number
Density
Org.
Package
Component Number 8EA 8EA 8EA 8EA
Vcc
SPEED
HMF1M32M8P-55 HMF1M32M8P-70 HMF1M32M8P-90 HMF1M32M8P-120
4MByte 4MByte 4MByte 4MByte
1Mx32bit 1Mx32bit 1Mx32bit 1Mx32bit
72pin-SIMM 72pin-SIMM 72pin-SIMM 72pin-SIMM
5.0V 5.0V 5.0V 5.0V
55ns 70ns 90ns 120ns
URL : www.hbe.co.kr REV.02(August,2002)
11
HANBit Electronics Co., Ltd.


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